Asian enterprise LED bulb design ideas difference: heat dissipation structure [disassembly]

Related information : Asian enterprises LED Bulb design ideas difference analysis [full version]

In terms of the design of the heat dissipation mechanism, there are also significant differences between Japanese manufacturers and overseas manufacturers (Figure 6, Figure 7). Toshiba's lighting technology uses a 7.2W product with a high-efficiency COB-type LED to directly dissipate the heat of the LED to a circular aluminum plate and then to the base. The round aluminum plate and the base are not closely attached, "it is not a high heat dissipation structure" (assisted technicians).

Figure 6: Investigate the heat dissipation mechanism of Group A (click on the image to enlarge)

Note: It is estimated that Toshiba Lighting's 7.2W product simplifies the heat dissipation mechanism by using LED components with high luminous efficiency. The 7.1W product of Samsung LED and the 7.5W product of Qinshang Optoelectronics use a heat dissipation mechanism equipped with a large number of heat sinks. The role of the component is speculated by the site. The khaki part of the photo is the tape that is used to identify the individual when disassembling.

Figure 7: Heat dissipation mechanism of group B (click on image to enlarge)

Note: A large number of heat sinks equipped with heat sinks are used. Many products add heat-dissipating grease and heat sink between the LED package substrate and the base. However, no heat grease was seen on Star Comgistic Capital's 4W product.

LED lamps of overseas manufacturers mostly adopt a structure in which an LED package substrate and a base (heat sink) are closely attached. In addition, there are many products that planarize the surface of the base to which the LED package substrate is attached by mechanical processing, and improve the adhesion by applying a thermal grease. "Because the heat loss of the LED chip is large, it is spent on the heat dissipation mechanism accordingly" (assisted by the technician).

Although it seems that overseas manufacturers are spending a lot of money on the cooling mechanism, the technicians who assisted in dismantling pointed out that "the price of the heat-dissipating parts of the LED bulb is not high." For example, aluminum die-cast bases with heat sinks are "only 50 to 60 yen each" (technicians of LED bulb manufacturers). The price of the LED package is "100 yen per watt (W)" (the technician), so it seems that reducing the number of chips and improving the heat dissipation mechanism can lower the overall cost.

Conversely, even simplifying the heat dissipation mechanism may not cut costs. For example, Toshiba Lighting's 7.2W product "simplifies the heat dissipation mechanism, but causes the temperature inside the base to rise. Therefore, it is necessary to replace the components of the power module with high heat-resistant products. As a result, the overall cost and the original with the heat sink The same product" (Toshiba Lighting Technology).


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