Leshi super 4 Max70 fanless active cooling is what ghost?

Even if other brands have released new products in the past year, LeTV Super 4 Super 70 Split TV has remained the strongest performer of smart TV since its release in December 2015. Why? This is thanks to the Qualcomm Snapdragon 810 processor in the Super 4 Max70 Smart Home Center, and the industry’s exclusive 4GB LPDDR4 memory and 64GB eMMC5.0 flash memory. However, do you know that Super 4 Max70 also has a hidden skill - fanless active cooling system?



Split TV's "bottleneck"

Letv Super TV is a brand that promises users to use products smoothly for 5-7 years. Ultra-high-performance Snapdragon 810 is the best choice. However, consumer demand for ultra-thin TVs is becoming increasingly apparent. At the same time, they hope to have high-quality shocking sound effects. This puts a very high demand on the design of smart TVs, resulting in split TV.




At the same time, this also puts forward higher requirements for the design of the mainframe part of the split smart TV design, because the space in the split host part is smaller. The ultra-high performance processor that Super 4 Max70 Smart Home Center is equipped with, at the same time, brings about heat dissipation. As a result, motherboard size and chip cooling have become a new “bottleneck” for smart TVs. However, this has been solved by LeTV's thermal design.

Gold ear certification audio + fanless active cooling

The original intention of LeTV Super 4 Max70's split design is to have a better screen quality and a thinner screen and more stunning sound quality. On the basis of the image quality of the 70-inch 4K LCD panel from Sharp's tenth-generation line, the Corning Iris Glass light guide plate from Corning Incorporated (which is the gorilla mobile phone glass) was used to achieve an ultra-thin thickness of 9.9mm. In order to shock the sound quality, LeEco and Harman Kardon, one of the world's most influential audio brands, jointly developed a super 4 Max70 smart home center sound system - the mystery of heat dissipation, in this set of Harman Kardon The Golden Ear Team creates an acoustic smart home center.




It is not passive cooling but active cooling. Instead of blowing by a fan, it is blown by an acoustic sound unit. This is the "active air-cooled heat dissipation design" that is incorporated into Harman Kardon audio on Super 4 Max70.

At present, our traditional hardware design uses a medium to transfer heat from the chip to the outside through the metal heat sink, but as the size of the host and the motherboard becomes smaller and smaller (the area of ​​the motherboard of the Super 4 Max70 smart home center is only 26.68. Cm2, which is 50% of a 50 cm2 conventional smart TV motherboard, makes heat dissipation more difficult. The usual solution is to use a fan to achieve air flow inside the machine. However, the LeTV Super 4 Max70 is different from the traditional, does not use the fan, but better than a fan. Because the acoustic sound unit replaces the fan, it does not increase the noise caused by the fan.

The LeTV Super 4 Max70 Smart Home Center's audio section was created by Levision with the Harman Karton Golden Ear Team. Contains 7 custom speaker units that can match the effects of a traditional 5.1-channel home theater. In addition to a single bass unit located in an independent wireless subwoofer, the rest of the main body of the long bar smart home center has two tweeters and four midrange units.




The mysteries of the Super 4 Max70 Smart Home Center without fan but active cooling are in the unique design of the six Harman Kardon audio units and their behind. In addition to the 6-unit Harman Karton audio, LeTV also designed trumpet-shaped ducts and metal cooling modules, as well as nano-scale thermal materials.

When the sound works, the diaphragm is driven forward and backward deformation, the air pressure inside the box will also change, and then in the opening position of the back and bottom of the fuselage and the outside world to create a positive and negative air pressure difference, drive the air through the speaker The conduits and the motherboard heat sinks eventually flow from the openings to the outside of the fuselage and take away heat generated by internal components such as the Qualcomm Snapdragon 810 processor. Eliminating the possibility of processor overheating and frequency reduction due to high temperatures, improving product stability, prolonging product lifespan, and achieving a 5-7 year commitment for users to use TVs smoothly.

Recently, it was reported that LeTV's high-profile declaration "no ecology is not AI," and recently released artificial intelligence TV. LeTV has a variety of ecological scenarios in which it learns user behaviors in a composite manner and develops powerful AI service capabilities. It serves disruptive innovations and serves every fan of the future with artificial intelligence products.


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