How is ultra-high thermal conductivity technology at the forefront of the LED lighting market?


     During the 20th Guangzhou International Lighting Exhibition held in Guangzhou, many companies brought the latest technology to the show . Suzhou Hot Chi Optoelectronics Technology Co., Ltd. , which is mainly engaged in the thermal conduction and heat dissipation technology of LED substrates , was founded by the company and brought the company's latest products for five consecutive years. Technology participates in the Guangya Exhibition. What is it that attracts Thermochi Optoelectronics every year to see Guangya Exhibition? This time, what new technologies have they brought to the led industry ? During the period, the editor of OFweek Semiconductor Lighting Network had an exclusive interview with Mr. Lin Wei, General Manager of Suzhou Reach Optoelectronics Technology Co., Ltd.

As the world's largest lighting exhibition, Guangya Exhibition is the vane of the development of the lighting industry every year. Mr. Lin said that the company is a high-tech company with material technology and coating common mode technology as its core. Since the establishment of the company in 2011, it has participated in the Guangya Exhibition, in order to show its own thermal and thermal brand advantages and help led enterprises to solve The problem of heat conduction and heat dissipation of the products, and the effective feedback from the customers through the exhibition, combined with the original technical improvements, can enable enterprises to stay in the forefront in the LED industry.

Ultra-high thermal conductivity technology in the forefront of LED lighting applications

LED is one of the typical materials for heat conduction, and it is inseparable from the use of heat sinks. However, there are too many other items that need to use heat-dissipating materials to improve the life, such as the internal parts of various electrical and electronic products. Application and promotion, future electrical products can also improve the utilization rate, increase the service life and reduce recycling. At present , the raw materials of the LED market are mainly applied to the LED circuit board. The heat dissipation of the LED is usually from the heat and light conversion efficiency of the chip, the circuit board, and the heat sink. Lin said that the company mainly focuses on the circuit board, so that the LED light source produces better light efficiency and longer life.

LED heating problems Like traditional light sources, semiconductor light-emitting diodes (LEDs) also generate heat during operation, depending on the overall luminous efficiency. Under the action of external electric energy, the radiation of electrons and holes recombines to produce electroluminescence, and the light radiated near the PN junction needs to pass through the semiconductor medium of the chip itself and the encapsulating medium to reach the outside (air).

Mr. Lin said that there is a certain development of high thermal conductivity technology on the market, and Reh is the only company in China with this technology. The thermostat ultra-high thermal conductivity diamond-like aluminum-based copper clad laminate is a traditional aluminum-based copper clad laminate structure. The innovative physical vapor deposition technology is used to form a diamond-like material-based insulating layer in a vacuum environment, thereby eliminating the traditional hot pressing. The combination of technology and polymer resin insulation layer can increase the thermal conductivity of aluminum-based copper clad laminate by a hundred times, which is close to the thermal conductivity of aluminum. The breakthrough of this technology lies in: (1) the choice of insulation layer, replacing the polymer resin insulation layer with diamond-like insulation layer, the thermal conductivity of diamond-like material reaches 800W/mK; (2) Process means: using magnetic control splash Injection and ion beam technology replace thermal compression technology. The super thermal conductivity of the thermostat ultra-high thermal conductivity diamond-like aluminum-clad copper clad plate has been tested and evaluated by companies such as Osram , Philips and Cree, and also by DK Thermal (leading circuit board processing company) and American Bergs (Leading aluminum-based copper clad laminate manufacturing companies) attention.

It is understood that the ultra-high thermal conductivity technology involves ultra-high thermal conductivity aluminum substrate, and the thermal conductivity is super strong. Lin always gave an example to the OFweek semiconductor lighting network to edit the aluminum substrate. He said that the ordinary aluminum substrate has a thermal conductivity of 2-3w. And ultra-high thermal conductivity reaches 100-200w.

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