DeLong laser picosecond laser cutting equipment won the 2011 Best Industrial Performance Product Award by 2011 Gaogong LED

From December 9th to 10th, the 2011 High-tech LED Annual Conference was held in Shenzhen Qingqing World as scheduled. The most exciting moment is the "2011 High-tech LED Annual Awards Appreciation Evening", which was staged at 19:00 on the evening of the 9th, and was called the "Oscar" ceremony in the LED industry. After nearly two months of selection, the major awards. It was announced one by one that night.

The selection activity was officially launched on October 15th. Through the nomination of industry experts, self-recommendation, netizen voting, survey verification, jury evaluation, etc., the CEO Award, Top Ten Famous Brands, Best Enterprise Awards, Best Product awards, best application engineering awards and other five categories of awards, eleven categories of awards.

Among them, DeLong laser picosecond laser cutting equipment SoftSweeper won the 2011 National Engineering Best Product Performance Award.

(The right one is represented by Delong Laser)

The jury believes that DeLong laser "picosecond" laser technology beats imported equipment in the field of micro-processing, "skill" seeks the "fine" soul, and the excellent cost performance overcomes the strong opponent.

Suzhou Delong Laser Co., Ltd. is located in Suzhou Industrial Park. It was founded in 2005 by China, the United States and Australia. It is committed to research, development, production and sales of high-end industrial application laser equipment, especially based on UV laser and ultrashort pulse laser technology. device of. Products are widely used in laser special processing, solar cells, LED, LCD and touch screen and other precision processing fields.

The SoftSweeper, a picosecond laser cutting device with completely independent intellectual property rights, has:

* Processing capacity: 19pcs/h @ 10*23mil (monthly capacity exceeds 10,000 pieces)
* Brightness after cutting is 5-10% higher than traditional laser dicing (brightness after packaging)
* The processing yield is better than the sidewall corrosion process 3-5%, and the chip performance is excellent.
* Standard 1064nm wavelength laser source for direct cutting of back-plated DBR chips
* Can directly cut chips below 200um thickness

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