Jieguo new material: a collection of LED glue debut in the light show

The 21st Guangzhou International Lighting Exhibition (Guangya Exhibition) was successfully held at the Pazhou Exhibition Hall in Guangzhou from June 9th to 12th. At the Dragon Boat Festival, Guangdong Jieguo New Materials Co., Ltd. (hereinafter referred to as “Jiguo New Material”) brought a number of LED glue products to the show, presenting the company’s image and products to domestic and foreign customers. technology.

Founded in December 2007, Jieguo Xincai is a professional manufacturer of epoxy resin adhesive for LED silicone encapsulant and precision electronic components integrating R&D, production and sales.

At this year's Guangya Exhibition, Jieguo New Materials will use LED filament glue as a key promotion product.

LED filament rubber series products are two-component high-viscosity translucent silicone rubber molding gels. The silicon-oxygen (si~0) bond is the main chain structure, so it is not easily decomposed by ultraviolet light and ozone. The chemical bond of the lower molecule does not break.

This product has the characteristics of high temperature resistance, no cracking, no fog, no oil, etc. It has good forming effect after dispensing; it has excellent adhesion with sapphire, ceramic, glass and metal packaging materials.

Dispensing molding glue

This series is a two-component high-viscosity translucent silicone rubber molding compound with a silicon-oxygen (si~0) bond as the main chain structure, so it is not easily decomposed by violet light and ozone.

At high temperatures (radiation is irradiated), the molecular bond does not break. The process is good, and it does not flow after dispensing, and can form an ideal shape; after curing, the colloid is translucent, and has excellent adhesion to substrates such as ceramics, glass and metal, and other packaging materials. It has excellent thermal conductivity, good electrical insulation and good sealing after curing.

In addition, two LED chip encapsulants have also become the highlights of the Guangya exhibition.

LED SMD encapsulant is a special silica gel for high refractive index TOP LED package. It has a silicon-oxygen (si~0) bond as the main chain structure, so it is not easily decomposed by violet light and ozone. The chemical bond of the molecule at high temperature (radiation or irradiation) Does not break.

The colloid has good elasticity after curing, has good adhesion, excellent electrical insulation performance and good air tightness.

This product has high resistance to vulcanization, UV, yellowing and weathering, and can be used for a long time (-50 ° C - 200 ° C).

These two products can be used in 2835, 3528, 5730, 5050, 3014, 5630 and other LED packages.

In addition to the above key product series, Jieguo New Materials also exhibited high-power COB and integrated light source encapsulant, which can be applied to high-power planar LED package; ceramic COB light source encapsulant; flip-chip COB light source encapsulant; The coupling glue can be applied to a series of products such as optocoupler chip protection.

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