Last year, the IECTC47/SC47E (Semiconductor Discrete Semiconductors Standardization Subcommittee) and IECTC47/SC47F (MEMS Standardization Subcommittee) working groups, along with MEMS standard seminars, were held in Tokyo, Japan. A total of 37 experts from China, Japan, and South Korea attended these events. The Chinese delegation included 12 representatives from institutions such as the China Electronics Technology Standardization Institute, China Electronics 13th Institute, Aerospace 704 Institute, China Machine Productivity Promotion Center, Peking University, and Xidian University. All members participated actively in every session.
IECTC47/SC47E consists of two working groups: WG1 (semiconductor sensor working group) and WG2 (microwave device working group). Meanwhile, IECTC47/SC47F includes three working groups and one maintenance group: WG1 (terms and definitions), WG2 (MEMS materials and structural test methods), WG3 (MEMS package and device), and MT1 (standard maintenance).
Significant progress was made on 18 international standards. After discussions and reviews by various working groups, standards like IEC 60747-14-10, which covers performance evaluation for wearable glucose sensors, and IEC 60747-14-11, which outlines measurement methods for surface-wave-based sensors measuring UV, light, and temperature, advanced significantly. These developments are summarized in Table 1.
Among the standards, three led by China are nearing the CD stage:
1. **IEC62047-32** – Jointly proposed by the Aerospace 704 Institute and China Electronics Standardization Institute, this standard defines test methods for nonlinear frequency response, strength, and frequency drift of MEMS resonators. It reflects the evolution of non-linear vibration testing from experimental to theoretical approaches, with a growing focus on multi-physics coupling.
2. **IEC62047-33** – Proposed by Peking University, it establishes terms, test conditions, and methods for MEMS piezoresistive pressure-sensitive devices. This is crucial for their development, production, and application, ensuring consistent performance and reliability.
3. **IEC62047-34** – Also proposed by Peking University, it specifies wafer-level performance parameters for MEMS piezoresistive pressure sensors, including resistance, output, and temperature characteristics. Detailed procedures and data processing methods are outlined.
Chinese experts also contributed to the development of IEC 60747-14-11, IEC 60747-18-3, and IEC 62047-31. For example, IEC 60747-14-11 outlines measurement methods for integrated UV, light, and temperature sensors using surface acoustic wave technology, while IEC 62047-31 evaluates interfacial adhesion energy via four-point bending.
New trends in standardization were also discussed. The SC47E Secretariat announced the establishment of TC124 (Wearable Device and Technology Standardization Committee), tasked with follow-up work on IEC 60747-14-10. South Korea proposed a new working group for bio-semiconductor devices, focusing on medical sensors like bio-FETs and lensless photonic arrays. An official document will be sent for member state feedback.
Additionally, TC49/WG13 (Piezoelectric Sensor Working Group) joined SC47E/WG1 to develop IEC 60747-14-11 jointly.
As technology evolves, interdisciplinary collaboration becomes more essential. Standards must adapt to keep up with rapid advancements.
The IECTC47/SC47F, established in 2008, is the most active subcommittee under TC47, with over five standards revised annually. Member countries include China, Japan, South Korea, Germany, and the U.S. Its three working groups focus on terminology, process standards, and device specifications.
At this meeting, the secretariat highlighted the need to update IEC62047-1 and IEC62047-4 to reflect current industry demands. Feedback from member states will be sought through official documents.
Moreover, technical seminars were held during the meeting, featuring presentations by experts from China, Japan, and South Korea. Topics included mechanical property testing platforms, smart sensor standardization, stress measurement techniques, and film adhesion evaluation. These sessions provided valuable insights into MEMS research and development.
Looking ahead, China should focus on MEMS standardization, particularly in design, materials, and performance testing. With the growing demand for MEMS sensors in consumer electronics, automotive, aerospace, and medical fields, leading in standardization will help drive industry growth.
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