ANSYS aims to revolutionize the engineering simulation experience and product development outcomes by tenfold across all physical domains and simulation types. This includes a tenfold improvement in user design performance, insight, and productivity. By significantly reducing time-to-market and cutting costs, users gain a competitive edge through faster innovation, higher efficiency, and superior product quality. With ANSYS 17.0 now available, the platform delivers on this ambitious vision.
For decades, ANSYS has been at the forefront of simulation-driven design. ANSYS 17.0 marks a significant milestone in integrating all modeling and simulation capabilities into a unified, open, behavior-based platform. This advancement supports the company's broader vision for an innovative product development ecosystem.
• Transient Electromagnetic Field Simulation Speeds Up by 10x:
The ANSYS Maxwell Transient Electromagnetic Field Solver introduces a groundbreaking time-domain decomposition algorithm that dramatically boosts computing power and speed. This patented technology distributes all time steps across multiple cores, networked computers, and clusters, enabling parallel processing rather than sequential solving. This breakthrough leads to unprecedented simulation speeds, transforming what once took weeks into just hours.
As motors and power transformers become more prevalent in advanced applications, their full transient analysis from startup to steady state can take up to two weeks. This limits the number of design iterations possible within a reasonable timeframe, affecting key design decisions. ANSYS 17.0 addresses this with its time-domain decomposition algorithm, which leverages hybrid HPC architecture to solve multiple time steps simultaneously, drastically increasing computation speed.
To use this feature, users must configure HPC modules, turning transient simulations into a routine part of the design process rather than a final verification step. Projects that once required weeks can now be solved in just a few hours, allowing engineers to evaluate critical transient behaviors like motor start-up and fault conditions much earlier in the design cycle. This reduces project risk and minimizes costly late-stage changes.
Alongside these improvements, new material modeling, design automation, and HiL/SiL enhancements provide powerful tools for industries involved in power electronics and control systems.
• Chip-Package-System (CPS) Workflow Productivity Increased by 10x:
The ANSYS Chip-Package-System (CPS) workflow enables the development of smaller, more energy-efficient, and portable devices. It features advanced 3D layout assembly, fast electromagnetic extraction solvers, IC model integration, and automated thermal analysis combined with structural simulation.
The CPS design flow replaces outdated partitioned methods with integrated modeling and proven simulation technologies. It’s an intelligent, highly integrated tool that considers chip effects to address challenges such as power integrity, signal integrity, EMI/EMC, ESD, and thermal stress.
ANSYS 17.0 introduces a unique layout assembly feature that integrates IC package layouts, interposers, connectors, ribbons, cables, and PCBs into a single model. This allows the CPS process to support both new and existing mobile electronic devices. Enhanced thermal analysis helps identify stress, deformation, and fatigue caused by high power density, improving overall design reliability.
Includes DDR4 Virtual Conformance Test in ANSYS CPS Process
The new ultra-fast chip package analysis (CPA) solver in ANSYS SIwave enhances the CPS design process. It quickly and accurately extracts power and signal networks from electronic packages, generating SPICE models per bump resolution and user-defined pin groupings with ground bounce behavior. Additional features include crosstalk scanning, automatic fault detection, and a 10x speedup in simulation using HPC technology.
ANSYS’ integrated circuit tools support critical functions such as power-to-heat, power-performance, and reliability analysis. With ANSYS Redhawk, Power ArTIst, and Totem, users can optimize dynamic power performance and build comprehensive system models for use in the full CPS workflow.
• Antenna and Wireless System Co-Simulation Efficiency Increased by 10x
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