ANSYS aims to revolutionize the engineering simulation experience and product development outcomes by tenfold, enhancing user design performance, insight, and productivity across all physical domains and simulation types. With this advancement, users can significantly reduce time-to-market while cutting costs substantially. This level of innovation, speed, efficiency, and quality ensures that users stay ahead of their competitors. ANSYS 17.0 has now been launched!
For decades, ANSYS has led the way in simulation-driven design. In ANSYS 17.0, the company has taken a major step forward by integrating its full range of modeling and simulation capabilities, enabling open, behavior-based, and integrated modeling and simulation. This supports the vision of a powerful product innovation platform.
**• Transient Electromagnetic Field Simulation Speeds Up by 10 Times:**
The ANSYS Maxwell Transient Electromagnetic Field Solver introduces a groundbreaking time-domain decomposition algorithm, offering users unprecedented computing power and speed. This patented technology distributes all time points across multiple cores, networked computers, and computational clusters, solving transient steps simultaneously rather than sequentially. This results in dramatically faster simulations, making it possible to complete complex analyses in hours instead of weeks.
In applications such as motors and power transformers, full transient analysis from start-up to steady state used to take up to two weeks. This limited the number of design iterations and hindered early decision-making. With ANSYS 17.0, the time-domain decomposition algorithm leverages hybrid high-performance computing (HPC) to solve multiple time steps at once, boosting performance through multi-core processing. This makes transient electromagnetic field simulation a routine part of the design process rather than just a final verification step. Complex projects that once took weeks can now be solved in just a few hours, allowing for early evaluation of critical transient behaviors like motor start-up and fault conditions. This reduces project risks and minimizes costly late-stage changes.
New time-domain decomposition algorithms, improved material modeling, design automation, and enhanced hardware-in-the-loop (HiL) and software-in-the-loop (SiL) features provide significant benefits for industries involved in power electronics and control simulations.
**• Chip-Package-System Workflow Productivity Increases by 10 Times:**
The ANSYS Chip-Package-System (CPS) workflow enables the creation of smaller, more energy-efficient, and portable devices. ANSYS CPS includes advanced 3D layout assembly, fast electromagnetic extraction solvers, IC model integration, and automated thermal analysis with structural analysis.
The CPS design flow replaces outdated partitioned methods with intelligent, highly integrated modeling and simulation technologies. It addresses key challenges such as power integrity, signal integrity, EMI/EMC, ESD, and thermal stress by considering chip effects throughout the design process.
ANSYS 17.0 introduces a unique layout assembly feature that combines IC package layout, interposer, connectors, ribbon cables, and PCB layouts into one unified model. This allows for efficient design of both new and existing mobile devices. The improved CPS workflow also features automated thermal analysis, which helps identify stress, deformation, and fatigue failure due to high power density.
The new ultra-fast chip package analysis (CPA) solver in ANSYS SIwave enhances CPS design capabilities. It quickly and accurately extracts power and signal networks from electronic packages, generating SPICE models per bump resolution and custom pin groupings with ground bounce behavior. Additional improvements include crosstalk scanning, automatic fault detection, and a 10x increase in simulation speed using HPC technology.
With tools like ANSYS Redhawk, Power ArTIst, and Totem, users can optimize dynamic power performance and build comprehensive system models within the CPS process.
**• Antenna and Wireless System Co-Simulation Efficiency Increased by 10 Times:**
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