ARM executives stated in the keynote that the size of semiconductor devices and battery technology are two obstacles that hinder the development of mobile systems with huge potential.
Simon Segars, general manager of ARM's physical IP division, said in the keynote speech at the annual Hot Chips event that "semiconductor size will come to an end, and I think the end point comes earlier than many people think. In addition, we urgently need new ones. Battery technology."
The size of the silicon atom has reached the nanometer radius, and the process technology has also entered the single-digit nano node. He said, "The dimensions can only reach this level before the III-V semiconductor material is applied."
Segars said that the difficulties of ultra-violet photolithography (EUV) in large-scale applications have caused some problems. The chip manufacturer must use complex double lithography pattern technology, plus the current infiltration system, while also waiting for the ultra-violet lithography required by the 14nm node.
"You need to produce 200-300 wafers per hour, but today's UV lithography equipment can only produce 5 wafers per hour." Segars said, "Some people wonder if ultra-ultraviolet lithography can become mainstream - indeed It also requires a lot of research and development to be used on a large scale."
The design problem is also very prominent. The complexity of 4G communication modules is more than 500 times that of 2G and requires a dedicated data processing engine.
The requirements for higher performance and capacity are increasing the complexity of multi-voltage domain and timing closure. He said that the ARM's manager guarantees that by 2015, the Cortex A15 will adopt a completely multi-CPU and GPU.
Battery technology presents the same challenge. The battery life is increased by 11% every year, which is far behind the development of Moore's Law. Timely maintenance of such slow development rates "requires very rare materials such as silicon alloys or carbon nanotubes," he said.
The other side of the problem is the great opportunity for the mobile market. Segars said, "The number is very large. Among the 4 billion mobile phone users last year, the sales of smart phones reached 280 million."
"Although we have made great progress, there will still be some new problems in the future that are not the same as before," he said.
Simon Segars, general manager of ARM's physical IP division, said in the keynote speech at the annual Hot Chips event that "semiconductor size will come to an end, and I think the end point comes earlier than many people think. In addition, we urgently need new ones. Battery technology."
The size of the silicon atom has reached the nanometer radius, and the process technology has also entered the single-digit nano node. He said, "The dimensions can only reach this level before the III-V semiconductor material is applied."
Segars said that the difficulties of ultra-violet photolithography (EUV) in large-scale applications have caused some problems. The chip manufacturer must use complex double lithography pattern technology, plus the current infiltration system, while also waiting for the ultra-violet lithography required by the 14nm node.
"You need to produce 200-300 wafers per hour, but today's UV lithography equipment can only produce 5 wafers per hour." Segars said, "Some people wonder if ultra-ultraviolet lithography can become mainstream - indeed It also requires a lot of research and development to be used on a large scale."
The design problem is also very prominent. The complexity of 4G communication modules is more than 500 times that of 2G and requires a dedicated data processing engine.
The requirements for higher performance and capacity are increasing the complexity of multi-voltage domain and timing closure. He said that the ARM's manager guarantees that by 2015, the Cortex A15 will adopt a completely multi-CPU and GPU.
Battery technology presents the same challenge. The battery life is increased by 11% every year, which is far behind the development of Moore's Law. Timely maintenance of such slow development rates "requires very rare materials such as silicon alloys or carbon nanotubes," he said.
The other side of the problem is the great opportunity for the mobile market. Segars said, "The number is very large. Among the 4 billion mobile phone users last year, the sales of smart phones reached 280 million."
"Although we have made great progress, there will still be some new problems in the future that are not the same as before," he said.
It is single signal transmission programmable led pixel strip. Only with One Data wire. the same as WS2811 and SK6812
But It is difference,the WS2812B is just addressable individually, IC just inside on the led.just have DC5V Working Voltage,can be control by extend controller to achieve the flash, movies and so on, Indoor and outdoor is suitable.
It is the most common single control led strips.
RGB LED Tape,WS2812B Rgb LED,WS2812B LED Strip,WS2812B Digital LED Strip
SHEN ZHEN SEL LIGHTING CO.,LTD , https://www.sellighting.com