With the rise of the Internet of Things (IoT) era, global terminal electronic devices are increasingly moving towards multi-function integration and low-power design. This shift has brought significant attention to SIP (System in Package) technology, which allows multiple bare chips to be integrated into a single package. Major players in expansion and testing, as well as wafer foundries and IC substrate manufacturers, are now investing heavily in SIP to meet growing market demands.
Recently, Apple introduced the latest Apple Watch, which utilizes a SIP-packaged chip to enhance both size and performance. This development marks a shift from traditional focus on power consumption reduction and performance improvement (as outlined by Moore’s Law) to a more practical approach that aligns with market needs—often referred to as "Beyond Moore’s Law."
According to the International Technology Roadmap for Semiconductors (ITRS), SIP is defined as a single unit that integrates various active components with different functions, along with optional passive elements and Other devices like MEMS or optical components, to form a system or subsystem within a standard package.
In architectural terms, SIP integrates multiple functional chips—such as processors and memory modules—into one package, enabling a nearly complete system functionality.
SOC, or System on Chip, refers to the integration of different ICs onto a single chip. This approach reduces overall size and improves performance by shortening the distance between components. A SOC contains an entire system, including embedded software, and represents a comprehensive solution designed for specific applications.
While SOC focuses on integrating all necessary components onto a single chip, SIP takes a packaging-centric approach, combining different chips, active components, and optional passive elements into a single package. Both technologies aim to integrate systems but differ in their implementation methods.
The key elements of SIP technology include package carriers and assembly processes. Carriers can be PCBs, LTCC, or silicon substrates, while the assembly process involves traditional techniques like wire bonding and flip-chip, as well as SMT (Surface Mount Technology). Passive components such as capacitors, resistors, and inductors play a vital role in SIP, with some integrated directly into the carrier and others mounted via SMT.
In terms of integration, SOC typically includes logic systems like application processors, whereas SIP goes a step further by integrating components like AP + mobile DDR. In the future, features like eMMC may also be incorporated into SIP, leading to even higher levels of integration.
From a packaging perspective, SOC has long been considered the key direction for future electronics due to its benefits in size, speed, and electrical performance. However, rising production costs and technical challenges have created bottlenecks in SOC development, prompting increased interest in SIP as a viable alternative.
SIP packaging comes in various forms, including 2D and 3D configurations. While 2D packages arrange chips side by side, 3D packages stack them vertically, allowing for greater integration. Internal bonding techniques can range from simple wire bonding to flip-chip, or a combination of both.
Additionally, multi-functional substrates can be used to embed different components, offering flexibility in design and customization based on specific product requirements.
Despite its advantages, SIP faces several technical challenges. For instance, 3D stacking introduces complexities in routing, signal integrity, and thermal management. As module complexity increases, so does the need for advanced simulation tools to ensure optimal performance.
Looking ahead, both SOC and SIP will continue to evolve. While SOC remains a strong contender for highly integrated systems, SIP offers a more flexible and scalable solution, especially as cost and design barriers decrease. With ongoing advancements, we can expect to see even more sophisticated integration solutions in the future.
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