The heat dissipation effect is not very good. For the high temperature of the existing products, in order to ensure that the chassis and other results remain unchanged, we have simulated and optimized the heat dissipation fins and proposed a structure that meets the results after optimization. Due to the interference of the chassis structure and internal components, the maximum height of the fins is limited to 8mm, and greater than 8mm will interfere with other components. Using the optimization function of Icepak software, we set two parameters a (fin thickness) and b (fin height), giving the value of a as the maximum temperature of the overall model, and the thickness and height of the fin can be used as independent functions , F as the dependent variable for optimal design, respectively calculated 16 sets of data, and obtained the calculation results. In the optimization graph, we can see that the CPU temperature is the lowest when a = 1 and b = 8, which is 84.5 °. The combination of other data is higher than this temperature. Under the premise of satisfying the results of the chassis, the maximum temperature is reduced by about 6 ° compared with the size before optimization. When the thickness is set to 1mm and the height to 8mm, we simulate the temperature cloud obtained and the maximum temperature is 84.5 °. Verified that the optimization process is correct.
The simulation and simulation of the thickness and height of the heat dissipation fins of the injection molding machine controller in a specific environment. Through the optimization analysis of the thickness and height of the fins, the conclusions are as follows: 1) After this optimization design, we can see the heat dissipation fins Under certain circumstances, the thickness and height of the sheet have an optimal value. They affect each other's heat dissipation effect of the fins. In this project, when the thickness is 1mm and the height is 8mm, the heat dissipation effect is the best, which is about 6 ° lower than the maximum temperature before optimization. 2) In the limited space and natural convection, the heat dissipation of electronic equipment mainly depends on the fins. The reasonable design of the fin size can effectively improve the heat dissipation effect. 3) Through this optimization analysis, it provides relevant basis for a company to improve the heat dissipation effect of the product in the next step. Also used Icepak software to make an attempt in the optimized design of electronic equipment.
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